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Capacités variables et inductances MEMS RF pour une intégration "Above-IC"

Publications associées (31)

3D diffractive optics for linear interconnects and nonlinear processing

The optical domain presents potential avenues for enhancing both computing and communication due to its inherent properties of bandwidth, parallelism, and energy efficiency. This research focuses on harnessing 3-Dimensional (3D) diffractive optics for nove ...

EPFL2024

Hydrogen-induced tunable remanent polarization in a perovskite nickelate

Michele Kotiuga

Materials with field-tunable polarization are of broad interest to condensed matter sciences and solid-state device technologies. Here, using hydrogen (H) donor doping, we modify the room temperature metallic phase of a perovskite nickelate NdNiO3 into an ...

Nature Portfolio2024

Room-temperature quantum optomechanics using an ultralow noise cavity

Tobias Kippenberg, Alberto Beccari, Nils Johan Engelsen, Guanhao Huang

At room temperature, mechanical motion driven by the quantum backaction of light has been observed only in pioneering experiments in which an optical restoring force controls the oscillator stiffness1,2. For solid-state mechanical resonators in which oscil ...

Nature Portfolio2024

Graph generative deep learning models with an application to circuit topologies

Igor Krawczuk

Modern integrated circuits are tiny yet incredibly complex technological artifacts, composed of millions and billions of individual structures working in unison. Managing their complexity and facilitating their design drove part of the co-evolution of mode ...

EPFL2024

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3D diffractive optics for linear interconnects and nonlinear processing

Niyazi Ulas Dinç

EPFL2024

Hydrogen-induced tunable remanent polarization in a perovskite nickelate

Michele Kotiuga

Nature Portfolio2024

Room-temperature quantum optomechanics using an ultralow noise cavity

Tobias Kippenberg, Alberto Beccari, Nils Johan Engelsen, Guanhao Huang

Nature Portfolio2024

Graph generative deep learning models with an application to circuit topologies

Igor Krawczuk

EPFL2024

Contemporary Logic Synthesis: with an Application to AQFP Circuit Optimization

Siang-Yun Lee

Electronic devices play an irreplaceable role in our lives. With the tightening time to market, exploding demand for computing power, and continuous desire for smaller, faster, less energy-consuming, and lower-cost chips, computer-aided design for electron ...

EPFL2024

Energy-Efficient Electronic Functions Based on the Co-integration of 2D and Ferroelectric Materials

Sadegh Kamaei Bahmaei

The digital revolution has significantly transformed our world over the past decades, driven by the scaling of transistor dimensions and the exponential increase in computation power. However, as the CMOS scaling era approaches its end, the semiconductor i ...

EPFL2023

Front-End Circuits for Radiation-Hard Monolithic CMOS Sensors targeting High-Energy Physics Applications

Francesco Piro

Monolithic pixel sensors integrate the sensor matrix and readout in the same silicon die, and therefore present several advantages over the more largely used hybrid detectors in high-energy physics. They offer an easier detector assembly, lower cost, lower ...

EPFL2023

First developments towards producing inductive magnetic sensors using state-of-the-art photolithography techniques

Duccio Testa, Marcus Cemes, Ambrine Douhane

Inductive magnetic sensors are needed for tokamak operation to provide the low-frequency (LF) measurements leading to the equilibrium reconstruction and to monitor the higher frequency (HF) instabilities; the HF magnetic sensors are often also used as a ba ...

2023

Integrated silicon photonic MEMS

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi

Silicon photonics has emerged as a mature technology that is expected to play a key role in critical emerging applications, including very high data rate optical communications, distance sensing for autonomous vehicles, photonic-accelerated computing, and ...

SPRINGERNATURE2023

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

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