Publications associées à Approximate 32-Bit Floating-Point Unit Design with 53% Power-Area Product Reduction

Fab-to-fab and run-to-run variability in 130 nm and 65 nm CMOS technologies exposed to ultra-high TID

Jean-Michel Sallese, Adil Koukab, Gennaro Termo, Stefano Michelis

The discovery of a large fab-to-fab variability in the TID response of the CMOS technologies used in the design of ASICs for the particle detectors of the HL-LHC triggered a monitoring effort to verify the consistency of the CMOS production process over ti ...

IOP Publishing Ltd2023

Acceleration of Control Intensive Applications on Coarse-Grained Reconfigurable Arrays for Embedded Systems

David Atienza Alonso, Miguel Peon Quiros, Benoît Walter Denkinger

Embedded systems confront two opposite goals: low-power operation and high performance. The current trend to reach these goals is toward heterogeneous platforms, including multi-core architectures with heterogeneous cores and hardware accelerators. The lat ...

2023

Compilation and Design Space Exploration of Dataflow Programs for Heterogeneous CPU-GPU Platforms

Aurélien François Gilbert Bloch

Today's continued increase in demand for processing power, despite the slowdown of Moore's law, has led to an increase in processor count, which has resulted in energy consumption and distribution problems. To address this, there is a growing trend toward ...

EPFL2023

Fast Parallel Algorithms for Enumeration of Simple, Temporal, and Hop-constrained Cycles

Paolo Ienne, Kubilay Atasu, Jovan Blanusa

Cycles are one of the fundamental subgraph patterns and being able to enumerate them in graphs enables important applications in a wide variety of fields, including finance, biology, chemistry, and network science. However, to enable cycle enumeration in r ...

Assoc Computing Machinery2023

Post-Moore's Law Fusion: High-Bandwidth Memory, Accelerators, and Native Half-Precision Processing for CPU-Local Analytics

Anastasia Ailamaki, Viktor Sanca

Modern data management systems aim to provide both cutting-edge functionality and hardware efficiency. With the advent of AI-driven data processing and the post-Moore Law era, traditional memory-bound scale-up data management operations face scalability ch ...

2023

Instruction-Level Power Side-Channel Leakage Evaluation of Soft-Core CPUs on Shared FPGAs

Mathias Josef Payer, Mirjana Stojilovic, Shashwat Shrivastava, Ognjen Glamocanin, Jinwei Yao, Nour Ardo

Side-channel disassembly attacks recover CPU instructions from power or electromagnetic side-channel traces measured during code execution. These attacks typically rely on physical access, proximity to the victim device, and high sampling rate measuring in ...

2023

Exploring brain-inspired multi-core heterogeneous hardware templates for low-power biomedical embedded systems

Benoît Walter Denkinger

The miniaturization of integrated circuits (ICs) and their higher performance and energy efficiency, combined with new machine learning algorithms and applications, have paved the way to intelligent, interconnected edge devices. In the medical domain, they ...

EPFL2023

A 0.21-ps FOM Capacitor-Less Analog LDO with Dual-Range Load Current for Biomedical Applications

Mahsa Shoaran, Yasemin Engür

This paper presents an output capacitor-less low-dropout regulator (LDO) with a bias switching scheme for biomedical applications with dual-range load currents. Power optimization is crucial for systems with multiple activation modes such as neural interfa ...

ArXiv2023

Automatic and high-precision acoustic emission-based structural health monitoring of concrete structures

Brice Tanguy Alphonse Lecampion, Seyyedmaalek Momeni

Acoustic emission (AE) monitoring is a useful technique to monitor the health of a structure continuously, helping to prevent potential failure. AE are elastic waves produced and emitted during fracture processes inside a material and are recorded by senso ...

DESTech publications inc.2023

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023