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Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation

New Technologies to Enhance the Figures-of-Merit of GaN Power Devices

Diamond on GaN integration for power semiconductor devices with efficient thermal management

Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation

New Technologies to Enhance the Figures-of-Merit of GaN Power Devices

Diamond on GaN integration for power semiconductor devices with efficient thermal management