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Concept
Recovery (metallurgy)
Summary
In metallurgy, recovery is a process by which a metal or alloy's deformed grains can reduce their stored energy by the removal or rearrangement of defects in their crystal structure. These defects, primarily dislocations, are introduced by plastic deformation of the material and act to increase the yield strength of a material. Since recovery reduces the dislocation density, the process is normally accompanied by a reduction in a material's strength and a simultaneous increase in the ductility. As a result, recovery may be considered beneficial or detrimental depending on the circumstances.
Recovery is related to the similar processes of recrystallization and grain growth, each of them being stages of annealing. Recovery competes with recrystallization, as both are driven by the stored energy, but is also thought to be a necessary prerequisite for the nucleation of recrystallized grains. It is so called because there is a recovery of the electrical conductivity due to a reduction in dislocations. This creates defect-free channels, giving electrons an increased mean free path.
The physical processes that fall under the designations of recovery, recrystallization and grain growth are often difficult to distinguish in a precise manner. Doherty et al. (1998) stated:
"The authors have agreed that ... recovery can be defined as all annealing processes occurring in deformed materials that occur without the migration of a high-angle grain boundary"
Thus the process can be differentiated from recrystallization and grain growth as both feature extensive movement of high-angle grain boundaries.
If recovery occurs during deformation (a situation that is common in high-temperature processing) then it is referred to as 'dynamic' while recovery that occurs after processing is termed 'static'. The principal difference is that during dynamic recovery, stored energy continues to be introduced even as it is decreased by the recovery process - resulting in a form of dynamic equilibrium.
Official source
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