Through-silicon viaIn electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
IntelIntel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years.
Open-source hardwareOpen-source hardware (OSH) consists of physical artifacts of technology designed and offered by the open-design movement. Both free and open-source software (FOSS) and open-source hardware are created by this open-source culture movement and apply a like concept to a variety of components. It is sometimes, thus, referred to as FOSH (free and open-source hardware). The term usually means that information about the hardware is easily discerned so that others can make it – coupling it closely to the maker movement.
First-person (video games)In video games, first person is any graphical perspective rendered from the viewpoint of the player's character, or a viewpoint from the cockpit or front seat of a vehicle driven by the character. The most popular type of first-person video game today is the first-person shooter (FPS), in which the graphical perspective is an integral component of the gameplay.
64-bit computingIn computer architecture, 64-bit integers, memory addresses, or other data units are those that are 64 bits wide. Also, 64-bit CPUs and ALUs are those that are based on processor registers, address buses, or data buses of that size. A computer that uses such a processor is a 64-bit computer. From the software perspective, 64-bit computing means the use of machine code with 64-bit virtual memory addresses.
IA-32IA-32 (short for "Intel Architecture, 32-bit", commonly called i386) is the 32-bit version of the x86 instruction set architecture, designed by Intel and first implemented in the 80386 microprocessor in 1985. IA-32 is the first incarnation of x86 that supports 32-bit computing; as a result, the "IA-32" term may be used as a metonym to refer to all x86 versions that support 32-bit computing. Within various programming language directives, IA-32 is still sometimes referred to as the "i386" architecture.
Balance wheelA balance wheel, or balance, is the timekeeping device used in mechanical watches and small clocks, analogous to the pendulum in a pendulum clock. It is a weighted wheel that rotates back and forth, being returned toward its center position by a spiral torsion spring, known as the balance spring or hairspring. It is driven by the escapement, which transforms the rotating motion of the watch gear train into impulses delivered to the balance wheel.
Hyper-threadingHyper-threading (officially called Hyper-Threading Technology or HT Technology and abbreviated as HTT or HT) is Intel's proprietary simultaneous multithreading (SMT) implementation used to improve parallelization of computations (doing multiple tasks at once) performed on x86 microprocessors. It was introduced on Xeon server processors in February 2002 and on Pentium 4 desktop processors in November 2002. Since then, Intel has included this technology in Itanium, Atom, and Core 'i' Series CPUs, among others.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
