Comparison of instruction set architecturesAn instruction set architecture (ISA) is an abstract model of a computer, also referred to as computer architecture. A realization of an ISA is called an implementation. An ISA permits multiple implementations that may vary in performance, physical size, and monetary cost (among other things); because the ISA serves as the interface between software and hardware. Software that has been written for an ISA can run on different implementations of the same ISA.
Clock rateIn computing, the clock rate or clock speed typically refers to the frequency at which the clock generator of a processor can generate pulses, which are used to synchronize the operations of its components, and is used as an indicator of the processor's speed. It is measured in the SI unit of frequency hertz (Hz). The clock rate of the first generation of computers was measured in hertz or kilohertz (kHz), the first personal computers (PCs) to arrive throughout the 1970s and 1980s had clock rates measured in megahertz (MHz), and in the 21st century the speed of modern CPUs is commonly advertised in gigahertz (GHz).
Wire bondingWire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages.
Profiling (computer programming)In software engineering, profiling ("program profiling", "software profiling") is a form of dynamic program analysis that measures, for example, the space (memory) or time complexity of a program, the usage of particular instructions, or the frequency and duration of function calls. Most commonly, profiling information serves to aid program optimization, and more specifically, performance engineering. Profiling is achieved by instrumenting either the program source code or its binary executable form using a tool called a profiler (or code profiler).
Ball grid arrayA ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Pin grid arrayA pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP).
High-κ dielectricIn the semiconductor industry, the term high-κ dielectric refers to a material with a high dielectric constant (κ, kappa), as compared to silicon dioxide. High-κ dielectrics are used in semiconductor manufacturing processes where they are usually used to replace a silicon dioxide gate dielectric or another dielectric layer of a device. The implementation of high-κ gate dielectrics is one of several strategies developed to allow further miniaturization of microelectronic components, colloquially referred to as extending Moore's Law.
16-bit computing16-bit microcomputers are microcomputers that use 16-bit microprocessors. A 16-bit register can store 216 different values. The range of integer values that can be stored in 16 bits depends on the integer representation used. With the two most common representations, the range is 0 through 65,535 (216 − 1) for representation as an (unsigned) binary number, and −32,768 (−1 × 215) through 32,767 (215 − 1) for representation as two's complement. Since 216 is 65,536, a processor with 16-bit memory addresses can directly access 64 KB (65,536 bytes) of byte-addressable memory.
Wafer-level packagingWafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached.
Semiconductor packageA semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure.
