Sam Neuser
Self-healing materials are a novel class of materials able to repair structural or, more generally, functional damage to a part. They hence have the potential to improve reliability and cost effectiveness, because failure or loss of functionality may be postponed or completely avoided. This concept has been applied to all classes of materials, but is particularly suited to polymers and their composites. Indeed, it was first demonstrated for epoxies containing capsules of dicyclopentadiene and dispersed Grubbs’ catalyst. However, the high cost of the catalyst precludes commercial use of this self-healing system. In the present thesis, two alternative approaches to self-healing of an epoxy matrix were investigated: (1) a solvent based self-healing epoxy; (2) a two-component epoxy/amine self-healing system using a novel encapsulation technique. The solvent-based system showed efficient healing in an under-cured epoxy matrix. The solvent in question was ethyl phenylacetate (EPA) encapsulated with urea-formaldehyde (UF) or UF-polyurethane. It was demonstrated that during a crack event, the solvent diffused into the epoxy matrix following a non-Fickian case II profile, with a geometrical swelling of the surface layer of the crack. For a healing time of 24h, a critical crack gap of 30μm was identified, beyond which the swelling was insufficient to bridge the crack faces and the healing efficiency was limited to around 25%. For smaller crack gaps, solvent swelling led to intimate contact of the crack faces and reaction of residual functional groups through a reduction of the glass transition temperature Tg of the epoxy, resulting in improved healing efficiency. The use of shape memory alloys (SMA) that are strained during the fracture event and subsequently heated to reduce the crack opening was also investigated. High healing efficiencies were observed and it was found that longer SMA wire activation times further improved the healing efficiency up to almost 80% through improved crack closure and an increased degree of polymerization. The behavior of this material during aging was then investigated in partially cracked samples, guaranteeing small crack gaps. It was found that the premature diffusion of the solvent through the microcapsule membrane into the epoxy matrix led to a decrease in healing efficiency from around 75% in fresh samples, to about 15% in samples aged for 75 days. Increasing the thickness of the polymeric shell of the capsules did not significantly improve performance. Moreover, moisture uptake by the epoxy also contributed to the reduced healing efficiency. Because the healing agent is hydrophobic, a higher water content in the epoxy matrix limited solvent diffusion into the epoxy and hence the extent of healing. A potential solution to the problem of premature diffusion of solvent into the epoxy is suggested to be the use of other shell materials or additional coatings on the capsules. The response of the solvent based self-healing system to dynamic fatigue was also studied. While in static testing, matrix swelling governs crack healing, a different mechanism was observed in the case of dynamic loading. In contrast to the unmodified epoxy, which showed rapid crack propagation under all the conditions investigated, in the presence of the solvent, crack arrest was observed for stress intensities of up to 0.48 MPam1/2. This phenomenon was attributed to crack pinning owing to diffusion of the solvent into the matrix surrounding the crack tip. The elongation at break of the solvated epoxy increased threefold, and the Young’s modulus decreased by more than 50%. Using finite element analysis (FEM) to model the stress distribution around the solvent-infused crack tip, it was shown that the local crack tip stress was reduced by 43%, accounting for this novel toughening effect. While solvent healing performed well in an under-cured matrix and interesting phenomena were observed, a fully cured matrix with a two-component self-healing system may be preferable for real applications because it avoids issues pertaining to premature solvent diffusion. The possibility of encapsulating an amine curing agent in a core-shell structure was therefore investigated as an alternative. A microfluidic glass chip was used to encapsulate a hydrophilic amine/water based curing agent in an acrylate resin shell using ex-situ exposure to UV light. Low viscosity epoxy was encapsulated with UF using a modified agitated emulsion encapsulation technique. Successful self-healing was demonstrated for epoxy specimens containing these microcapsules, along with embedded SMA wires, with healing efficiencies of up to 100% and 40% for low and high temperature curing epoxy, respectively. Overall, this work represents a significant step towards affordable epoxy self-healing materials, the feasibility of solvent and epoxy/amine healing having been successfully demonstrated for an epoxy matrix. The epoxy/amine self-healing system is thought to be particularly promising, considering the early stage of development. Furthermore, the integration of SMA wires proved to improve healing efficiencies dramatically, especially with the epoxy/amine microcapsules. With further optimization and scale-up of the microfluidic encapsulation method, a new low cost self-healing system, and hence potentially compatible with a wide range of polymeric materials, including composites, is therefore within reach because it is based on a commonly used epoxy/amine adhesive.
EPFL2013
