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Covers design considerations, skin structure, stress and strain, mechanoreceptors, substrates, and strain effects on electrical resistance in flexible bioelectronics.
Explores encapsulation in OLED technology, covering packaging materials, defects, thin film encapsulation, barrier mechanics, and new packaging materials.
Explores thin film measurement techniques in micro and nanofabrication processes, comparing reflectometry and ellipsometry for accuracy and methodology.
Explores low-dimensional devices, focusing on nanowires and quantum dots, their properties, applications, and the challenges in their fabrication and performance.
