Concept
Thermal resistance
Related concepts (11)
Heat transfer coefficient
In thermodynamics, the heat transfer coefficient or film coefficient, or film effectiveness, is the proportionality constant between the heat flux and the thermodynamic driving force for the flow of heat (i.e., the temperature difference, ΔT ). It is used in calculating the heat transfer, typically by convection or phase transition between a fluid and a solid. The heat transfer coefficient has SI units in watts per square meter per kelvin (W/m2/K).
Operating temperature
An operating temperature is the allowable temperature range of the local ambient environment at which an electrical or mechanical device operates. The device will operate effectively within a specified temperature range which varies based on the device function and application context, and ranges from the minimum operating temperature to the maximum operating temperature (or peak operating temperature). Outside this range of safe operating temperatures the device may fail. It is one component of reliability engineering.
Thermal management (electronics)
All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.
Biot number
The Biot number (Bi) is a dimensionless quantity used in heat transfer calculations, named for the eighteenth-century French physicist Jean-Baptiste Biot (1774–1862). The Biot number is the ratio of the thermal resistance for conduction inside a body to the resistance for convection at the surface of the body. This ratio indicates whether the temperature inside a body varies significantly in space when the body is heated or cooled over time by a heat flux at its surface.
Heat sink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules.
Lumped-element model
The lumped-element model (also called lumped-parameter model, or lumped-component model) is a simplified representation of a physical system or circuit that assumes all components are concentrated at a single point and their behavior can be described by idealized mathematical models. The lumped-element model simplifies the system or circuit behavior description into a topology. It is useful in electrical systems (including electronics), mechanical multibody systems, heat transfer, acoustics, etc.
Newton's law of cooling
In the study of heat transfer, Newton's law of cooling is a physical law which states that The rate of heat loss of a body is directly proportional to the difference in the temperatures between the body and its environment. The law is frequently qualified to include the condition that the temperature difference is small and the nature of heat transfer mechanism remains the same. As such, it is equivalent to a statement that the heat transfer coefficient, which mediates between heat losses and temperature differences, is a constant.
Heat transfer
Heat transfer is a discipline of thermal engineering that concerns the generation, use, conversion, and exchange of thermal energy (heat) between physical systems. Heat transfer is classified into various mechanisms, such as thermal conduction, thermal convection, thermal radiation, and transfer of energy by phase changes. Engineers also consider the transfer of mass of differing chemical species (mass transfer in the form of advection), either cold or hot, to achieve heat transfer.
Thermal conduction
Conduction is the process by which heat is transferred from the hotter end to the colder end of an object. The ability of the object to conduct heat is known as its thermal conductivity, and is denoted k. Heat spontaneously flows along a temperature gradient (i.e. from a hotter body to a colder body). For example, heat is conducted from the hotplate of an electric stove to the bottom of a saucepan in contact with it.
Thermal conductivity
The thermal conductivity of a material is a measure of its ability to conduct heat. It is commonly denoted by , , or . Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity. For instance, metals typically have high thermal conductivity and are very efficient at conducting heat, while the opposite is true for insulating materials like mineral wool or Styrofoam.