Voltaic pileThe voltaic pile was the first electrical battery that could continuously provide an electric current to a circuit. It was invented by Italian chemist Alessandro Volta, who published his experiments in 1799. Its invention can be traced back to an argument between Volta and Luigi Galvani, Volta’s fellow Italian scientist who had conducted experiments on frogs' legs.
HydrometallurgyHydrometallurgy is a technique within the field of extractive metallurgy, the obtaining of metals from their ores. Hydrometallurgy involve the use of aqueous solutions for the recovery of metals from ores, concentrates, and recycled or residual materials. Processing techniques that complement hydrometallurgy are pyrometallurgy, vapour metallurgy, and molten salt electrometallurgy.
Lead dioxideLead(IV) oxide, commonly known as lead dioxide, is the inorganic compound with the formula PbO2. It is an oxide where lead is in an oxidation state of +4. It is a dark-brown solid which is insoluble in water. It exists in two crystalline forms. It has several important applications in electrochemistry, in particular as the positive plate of lead acid batteries. Lead dioxide has two major polymorphs, alpha and beta, which occur naturally as rare minerals scrutinyite and plattnerite, respectively.
PewterPewter (ˈpjuːtər) is a malleable metal alloy consisting of tin (85–99%), antimony (approximately 5–10%), copper (2%), bismuth, and sometimes silver. Copper and antimony (and in antiquity lead) act as hardeners, but lead may be used in lower grades of pewter, imparting a bluish tint. Pewter has a low melting point, around , depending on the exact mixture of metals. The word pewter is probably a variation of the word spelter, a term for zinc alloys (originally a colloquial name for zinc).
Substrate (materials science)Substrate is a term used in materials science and engineering to describe the base material on which processing is conducted. This surface could be used to produce new film or layers of material such as deposited coatings. It could be the base to which paint, adhesives, or adhesive tape is bonded. A typical substrate might be rigid such as metal, concrete, or glass, onto which a coating might be deposited. Flexible substrates are also used. With all coating processes, the condition of the surface of the substrate can strongly affect the bond of subsequent layers.
Whisker (metallurgy)Metal whiskering is a phenomenon which occurs in electrical devices when metals form long whisker-like projections over time. Tin whiskers were noticed and documented in the vacuum tube era of electronics early in the 20th century in equipment that used pure, or almost pure, tin solder in their production. It was noticed that small metal hairs or tendrils grew between metal solder pads, causing short circuits. Metal whiskers form in the presence of compressive stress. Germanium, zinc, cadmium, and even lead whiskers have been documented.
Electroless copper platingElectroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde. Unlike electroplating, electroless plating processes in general do not require passing an electric current through the bath and the substrate; the reduction of the metal cations in solution to metallic is achieved by purely chemical means, through an autocatalytic reaction.
Surface finishingSurface finishing is a broad range of industrial processes that alter the surface of a manufactured item to achieve a certain property. Finishing processes may be employed to: improve appearance, adhesion or wettability, solderability, corrosion resistance, tarnish resistance, chemical resistance, wear resistance, hardness, modify electrical conductivity, remove burrs and other surface flaws, and control the surface friction. In limited cases some of these techniques can be used to restore original dimensions to salvage or repair an item.
