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Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling

Michel Rappaz, Aïcha Hessler-Wyser, Léa Deillon, Thierry Hessler

Au-In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu t ...

Institute of Physics2015

Implantable Multi-panel Platform for Continuous Monitoring of Exogenous and Endogenous Metabolites for Applications in Personalized Medicine

Camilla Baj-Rossi

Nowadays, scientific advances are leading to the discovery of newer, better, more targeted treatments that will improve the human health. However, despite the promising results and the major advantages in treatments offered to patients, these personalized ...

EPFL2015

Non-contact sub-nanometer optical repositioning using femtosecond lasers

Yves Bellouard

Optical components like resonator or waveguides often have stringent requirements in term of positioning accuracy during packaging. While this can be done routinely in a laboratory environment, permanently positioning and aligning optical elements with nan ...

Optical Society of America2015

An inertial sensor calibration platform to estimate and select error models

Jan Skaloud, Stéphane Guerrier

A new open-source software platform that, among others, allows to select models for inertial sensor stochastic calibration is presented in this paper. This platform consists in a package included in the statistical software R. The identification of stochas ...

IEEE2015

Reliability Aspects of Microelectromechanical Systems for Space Applications : Mechanical Properties of Structural Materials and Analysis of Packaging Strains

Tobias Bandi

Microelectromechanical systems (MEMS) are an essential ingredient in many technological innovations and a source of game-changing inventions in the automotive industry, space exploration, consumer electronics and medical applications due to its capability ...

EPFL2014

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

John Richard Thome, Jackson Braz Marcinichen, Yassir Madhour, Brian Paul D'Entremont, Bruno Michel

Three-dimensional (3D) stacking of integrated-circuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with area-array through-silicon-vias (TSVs). This reduces the length of global interconnects and t ...

American Society of Mechanical Engineers2014

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