Concept

Electroless copper plating

Related publications (15)

Fretting-corrosion behavior of electroless Ni-P/Ni-P-TiO2 coatings obtained on AZ91D magnesium alloy by a chromium-free process

Ni-P electroless coatings are widely applied for protection of magnesium alloys and other materials due to the low energy consumption of the process and high resistance to corrosion and wear, properties that can be improved with the incorporation of partic ...

ELSEVIER2020

Microchannel contacting of crystalline silicon solar cells

Monica Morales Masis, Stephanie Essig

There is tremendous interest in reducing losses caused by the metal contacts in silicon photovoltaics, particularly the optical and resistive losses of the front metal grid. One commonly sought-after goal is the creation of high aspect-ratio metal fingers ...

Nature Publishing Group2017

A Chip-Level Post-CMOS Via-Last Cu TSV Process for Multi-Layer Homogeneous 3D Integration

Seniz Esra Küçük, Yusuf Leblebici, Woo Yeong Cho

In this paper, a die-level CMOS post-processing scheme for 3D integration using the via-last approach is presented for multi-layer stacking. The process includes TSV fabrication, chip-to-chip bonding, and finally the TSV filling with Cu electroplating. The ...

Ieee2016

W-Band Waveguide Filters Fabricated by Laser Micromachining and 3-D Printing

Emile Jacques de Rijk, Mathieu Billod, Cheng Guo

This paper presents two W-band waveguide bandpass filters, one fabricated using laser micromachining and the other 3-D printing. Both filters are based on coupled resonators and are designed to have a Chebyshev response. The first filter is for laser micro ...

Ieee-Inst Electrical Electronics Engineers Inc2016

Interaction between liquid aluminium and solid iron Al-rich intermetallics formation

Guillaume Pasche

Intermetallic phases formation is one of the phenomena, which when coupled to thermal and mechanical strains leads to the premature wear of aluminium die casting tools made out of steel. This work focuses on two aspects of this wear problem. The first and ...

EPFL2013

Cost-effective thermally-managed 1.55-μm VECSEL with hybrid mirror on copper substrate

Elyahou Kapon, Alexandru Mereuta, Alexei Sirbu

An electroplated copper substrate was evaluated for heat dissipation in 1.55-μm optically pumped vertical extended cavity surface emitting lasers (OP-VECSELs). It is a cost-effective and flexible solution compared with the previously proposed chemical vapo ...

2012

A CMOS Compatible Chip-to-Chip 3D Integration Platform

Carlotta Guiducci, Michail Zervas, Yusuf Leblebici, Yüksel Temiz

In this paper, a CMOS-compatible chip-to-chip 3D integration platform will be presented. The developed technology allows reconstituting a wafer from diced and thinned chips. Then, chip-to-chip bonding and TSV fabrication steps are accomplished in wafer-lev ...

IEEE2012

3D Integration Technology for Lab-on-a-Chip Applications

Yüksel Temiz

This study adds a new dimension to lab-on-a-chip systems by employing three-dimensional (3D) integration technology for improved performance, higher functionality, and on-chip computational power. Despite the extensive amount of current research on 3D memo ...

EPFL2012

Device comprising electrical contacts and its production process

Christophe Ballif

The invention relates to a device comprising a conductive surface (12) and electrical contacts (14) by which an electric current is able to be passed. Said electrical contacts (14) comprise conductive seeds (16) deposited on the conductive surface (12), an ...

2011

Orthogonal fluxgate type magnetic microsensors with wide linear operation range

Ozge Zorlu

This thesis presents a study on the development of microfabricated fluxgate type magnetic sensors operating within a wide linear operation range. Fluxgate type magnetic sensors are powerful devices due to their high sensitivity, low offset, and high temper ...

EPFL2008

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