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Tempered glass panes are subjected to high eigenstresses that induce a state of compression along the surfaces and a state of tension in the inner part. Whenever a crack reaches the tensile region, it rapidly propagates and branches in all directions drive ...
A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are ch ...
Laminated and etched glazing unit for architectural integration of solar energy systems comprising a substrate delimited by two main faces and a multi-layered interference filter also delimited by two main faces, one main face of said substrate being adapt ...
Anyone who has ever broken a dish or a glass knows that the resulting fragments range from roughly the size of the object all the way down to indiscernibly small pieces: typical fragment size distributions of broken brittle materials follow a power law, an ...
Thermal boundary conductance (TBC) of the Ag/diamond and Au/diamond interfaces with a nanometer-thick interface layer of either nickel or molybdenum is measured by time domain thermoreflectance and modeled based on a 3-layer two-temperature model (3l-TTM). ...
Convergent beam electron diffraction (CBED) patterns of twisted bilayer samples exhibit interference patterns in their CBED spots. Such interference patterns can be treated as off-axis holograms and the phase of the scattered waves, and hence the interlaye ...
The Thermal Boundary Conductance (TBC) at the interface between metals and dielectrics is of key importance for heat transport in structures heterogeneous on a scale from 100 µm downwards. In this thesis the TBC of a large number of metal/dielectric couple ...
Product vacua with boundary states (PVBS) are cousins of the Heisenberg XXZ spin model and feature [Formula: see text] particle species on [Formula: see text]. The PVBS models were originally introduced as toy models for the classification of ground state ...
The influence of the thickness of a thin (1.5-30 nm) copper layer on the thermal boundary conductance (TBC) at the interface between gold and silicon, sapphire and diamond, respectively, was studied using Time Domain Thermoreflectance. Overall, a monotonic ...
This paper introduces a cost-effective strategy to simulate the behavior of laminated plates by means of isogeometric 3D solid elements. Exploiting the high continuity of spline functions and their properties, a proper out-of-plane stress state is recovere ...
