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This lecture covers various techniques for bonding glass to silicon, including field-assisted thermal bonding, thermal fusion bonding, anodic bonding, and pressure-assisted low-temperature fusion bonding. It explains the principles, parameters, advantages, and disadvantages of each technique, as well as the importance of matching thermal expansion coefficients. The instructor also discusses the mechanisms, applications, and evaluation methods of these bonding processes, highlighting the role of surface treatments, such as silane adhesion promotors, in enhancing adhesion strength.
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