A heat pipe is a heat-transfer device that employs phase transition to transfer heat between two solid interfaces. At the hot interface of a heat pipe, a volatile liquid in contact with a thermally conductive solid surface turns into a vapor by absorbing heat from that surface. The vapor then travels along the heat pipe to the cold interface and condenses back into a liquid, releasing the latent heat. The liquid then returns to the hot interface through capillary action, centrifugal force, or gravity and the cycle repeats.
Thermal radiation is electromagnetic radiation generated by the thermal motion of particles in matter. Thermal radiation is generated when heat from the movement of charges in the material (electrons and protons in common forms of matter) is converted to electromagnetic radiation. All matter with a temperature greater than absolute zero emits thermal radiation. At room temperature, most of the emission is in the infrared (IR) spectrum. Particle motion results in charge-acceleration or dipole oscillation which produces electromagnetic radiation.
Heat recovery ventilation (HRV), also known as mechanical ventilation heat recovery (MVHR), is an energy recovery ventilation system that operates between two air sources at different temperatures. It's a method that is used to reduce the heating and cooling demands of buildings. By recovering the residual heat in the exhaust gas, the fresh air introduced into the air conditioning system is preheated (or pre-cooled), and the fresh air's enthalpy is reduced before it enters the room, or the air cooler of the air conditioning unit performs heat and moisture treatment.
All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.
The volumetric heat capacity of a material is the heat capacity of a sample of the substance divided by the volume of the sample. It is the amount of energy that must be added, in the form of heat, to one unit of volume of the material in order to cause an increase of one unit in its temperature. The SI unit of volumetric heat capacity is joule per kelvin per cubic meter, J⋅K−1⋅m−3. The volumetric heat capacity can also be expressed as the specific heat capacity (heat capacity per unit of mass, in J⋅K−1⋅kg−1) times the density of the substance (in kg/L, or g/mL).
