Integration Examples

This lecture covers case studies on conductors and silver flakes, discussing their advantages, disadvantages, and cost issues. It also explores printing techniques for seed layers, process integration for TFTs, ink design challenges, inks curing, and materials needs for semiconductors. The lecture delves into high-performance printed OFETs, misalignment-tolerant structures, and the challenges of alignment scaling in printing processes, concluding with questions on the advantages of printing, physics of liquids on surfaces, substrate modification, printing techniques, curing processes, pattern formation, and material-device compatibility.