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Dr. Peter Ryser is a Professor Emeritus at the Swiss Federal Institute of Technology in Lausanne. He has over three decades of research and teaching experience from various corporate and academic institutions. He was previously a Director at Siemens Building Technologies where he was responsible for R&D, product innovation and patents. Dr. Ryser has a Ph.D. in applied Physics from the University of Geneva, a Masters degree in Experimental Physics and an MBA.

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Sensor

A sensor is a device that produces an output signal for the purpose of sensing a physical phenomenon. In the broadest definition, a sensor is a device, module, machine, or subsystem that detects ev

Resistor

A resistor is a passive two-terminal electrical component that implements electrical resistance as a circuit element. In electronic circuits, resistors are used to reduce current flow, adjust signal

Temperature

Temperature is a physical quantity that expresses quantitatively the perceptions of hotness and coldness. Temperature is measured with a thermometer. Thermometers are calibrated in various temperatur

Fabrication, response and stability of miniature piezoresistive force-sensing thick-film cantilevers

Caroline Jacq, Thomas Maeder, Peter Ryser

Miniature ceramic cantilevers have been successfully applied to the fabrication of simple and low-cost piezoresistive thick-film force-sensing cells, using different thick-film and LTCC (low-temperature co-fired ceramic) substrates. The availability of thin substrates for some materials allows much improved sensitivity compared to classical thick-film technology, with LTCC also featuring rather low substrate elastic modulus and fine structurability. However, practical applicability may be hindered by processing difficulties, such as printing and handling very thin fired substrates, or, in the case of co-fired tapes, warpage during firing. Also, signal drift is observed with some devices. In this work, we show that most of the previously-observed signal drift in some LTCC sensors is not due to self-heating, and therefore stems from defects such as micro-cracks within the ceramic cantilevers or plastic deformations in internal conductors. In a second step, we explore manufacturability of thick-film cantilevers on very thin substrates, and show that it is possible to print a single-sided design on substrates with thickness as low as 45 µm, although a lower limit of ~100 µm, depending on substrate material, is more practical.

2016

LTCC and thick-film ceramic magnetic sensors for tokamak nuclear fusion

Adrien Aymeric Thibault Corne, Lucas Güniat, Caroline Jacq, Xinyue Jiang, Thomas Maeder, Peter Ryser, Christian Schlatter, Martin Stöck, Duccio Testa, Matthieu Toussaint, Philipp Windischhofer

The present contribution gives an overview of our work on non-conventional magnetic coil sensors for diagnostics and plasma stability control of nuclear fusion experiments in tokamaks. Instead of wire wound around a core, these devices consist of printed conductor wire coils on ceramic substrates, and are based on LTCC (low-temperature co-fired ceramic) and thick-film technology, which allow creation of monolithic multilayer coils with excellent stability. For 3D sensing, an innovative modular design combining LTCC coils and an alumina base has been developed. Finally, the important aspects of integration, manufacturing, mounting and interconnection are discussed.

Elsevier2016

Solutions for thermally mismatched brazing operations for ceramic tokamak magnetic sensor

Caroline Jacq, Xinyue Jiang, Thomas Maeder, Peter Ryser, Duccio Testa, Matthieu Toussaint, Philipp Windischhofer

To monitor high-frequency fluctuations of the equilibrium magnetic field in tokamaks, a 3D magnetic sensor has been developed. The sensor, which is positioned inside the vacuum vessel behind the protective tiles of the tokamak and is exposed to potential temperatures up to 400°C, is based on thick-film and LTCC (low-temperature co-fired ceramic) technology. To connect the sensor to the cabling that runs inside the vacuum vessel, mineral-insulated cables have to be brazed to the sensor to ensure electrical connection together with mechanical robustness and sufficient thermal stability. As the brazing temperature is about 600°C, direct brazing to the alumina sensor substrate can cause failure by cracking induced by thermal stresses. It arises both by temperature gradients stemming from the localised heating and by the high thermal mismatch of alumina with the braze and wire materials. In previous work, high stresses from temperature gradients were efficiently decoupled by brazing indirectly to alumina beams attached to the main substrate, and local thermal stresses between alumina and braze/wire by using a porous metallisation. However, as the slender alumina beams protruding out of the substrate are somewhat cumbersome and fragile, three alternatives were studied in the present work: 1) testing shorter and more robust beams, 2) replacing the alumina beam by a silver wire, and 3) depositing a porous temperature- and stress-decoupling dielectric to enable direct brazing on the main alumina substrate. These solutions are characterised with respect to their mechanical robustness and of the degree of thermal decoupling with the substrate they provide.

2016