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We explore the influence of the metal microstructure on the compressive flow stress of replicated microcellular 400-mu m pore size Al-4.5 wt%Cu solidified at two different solidification cooling rates, in the as-cast and T6 conditions. It is found that the ...
Microcellular Al-4.5 wt pct Cu of 400- or 75-mu m average pore diameter is solidified at cooling rates ranging from -30 K/min to -0.45 K/min (-30 A degrees C/min to -0.45 A degrees C/min). In the 400-mu m pore size samples, the dendritic character is lost, ...
Scaling exponents for the conductivity and stiffness of replicated microcellular materials exceed commonly predicted values of 1 and 2. We show here that this is caused by the fact that, in replicated microcellular materials, the solid architecture varies ...