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Our planar SOFC stacking technology uses unprofiled metallic interconnects (MIC) and thin cells of tape cast anode supported YSZ. The key element is the gas diffusion layer (GDL) between cell and MIC, which consists of so-called SOFConnex™. Using square ce ...
2007
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Our planar SOFC stacking technology uses unprofiled metallic interconnects (MIC) and thin cells of tape cast anode supported YSZ. The key element is the gas diffusion layer (GDL) between cell and MIC, which consists of so-called SOFConnex™. Using square ce ...
The Electrochemical Society2007
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Our SOFC stack development technology is based on the unique SOFConnexTM concept, using flexible gas distribution layers between metal sheet interconnect and thin ASE cells. Flexibility is given both in material and design. This ensures proper electrical c ...