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Three binary Sn-Cu solder alloys of near-eutectic composition have been directionally solidified at different growth rates. The competition between primary tetragonal Sn cells/dendrites and eutectic is interpreted with the coupled zone concept. It is also ...
A systematic study of the solidification mechanisms of binary Sn-Cu and ternary Sn-Cu-Ni alloys has been carried out. It is found that Sn-Cu is a weakly-irregular eutectic system with Cu6Sn5 as the leading phase. Interestingly, two different eutectic morph ...
Five ternary Sn-0.7Cu-xNi alloys with nickel contents in the range 0-1000 ppm have been directionally solidified at different growth rates. The competition between primary tetragonal Sn cells/dendrites, eutectic and primary Cu6Sn5 is interpreted with phase ...