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Related publications (2)
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Five ternary Sn-0.7Cu-xNi alloys with nickel contents in the range 0-1000 ppm have been directionally solidified at different growth rates. The competition between primary tetragonal Sn cells/dendrites, eutectic and primary Cu6Sn5 is interpreted with phase ...
Alloys based on the Sn-0.7Cu-xNi system are potential Pb-free solders. In this paper we report on the solidification characteristics and microstructures of Sn-0.7Cu alloys containing 0-1,000 ppm nickel. The microstructural observations show that increasing ...
