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Göran Stemme

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Related publications (6)

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Göran Stemme

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Micro 3D printing of a functional MEMS accelerometer

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Micro 3D printing of a functional MEMS accelerometer

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires