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The chemical-mechanical polishing process (CMP) is an essential part of the production of integrated circuits. Metal to be polished in the CMP reacts with the oxidants from the aqueous suspension (slurry) and the passive film is formed on the metal surface ...
The corrosion and tribocorrosion of tungsten in 0.01 M H2SO4, without and with the presence of lactic acid and phosphoric acid as chelating agents was studied here. ...
This work presents an investigation of the tribocorrosion of ruthenium in sulphuric acid solutions. The study was focused on the effect of the electrode potential on wear of ruthenium during sliding against an inert alumina ball in a reciprocating sliding ...
The tribocorrosion behavior of tungsten sliding against an alumina ball was evaluated in sulfuric acid under applied electrode potential. Surface chemistry of worn and unworn surfaces was evaluated using XPS and AES. Quasi-potentiostatic polarization curve ...