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Venkatesh Sivasubramaniam

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Related publications (3)

Please note that this is not a complete list of this person’s publications. It includes only semantically relevant works. For a full list, please refer to Infoscience.

Correlation of microstructural and mechanical properties in particle reinforced lead-free solders

Venkatesh Sivasubramaniam

Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...

EPFL2009

Interfacial intermetallic growth and strength of composite lead-free solder alloy through isothermal aging

John Botsis, Joël Cugnoni, Venkatesh Sivasubramaniam

The effects of particle reinforcement of Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) lead-free solder on interfacial intermetallic layer growth and strength of the ensuing joints through short-term isothermal aging (150 degrees C) were studied. Composite solders were ...

Springer US2008

Experimental and numerical studies on size and constraining effects in lead-free solder joints

John Botsis, Joël Cugnoni, Venkatesh Sivasubramaniam

Search String Advanced > Saved Searches > ARTICLE TOOLS Get PDF (641K) Save to My Profile E-mail Link to this Article Export Citation for this Article Get Citation Alerts Request Permissions More Sharing ServicesShare | Share on citeuli ...

2007