Ayse Kivilcim Coskun

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Related publications (14)

Modeling and Dynamic Management of 3D Multicore Systems with Liquid Cooling

David Atienza Alonso, José Luis Ayala Rodrigo, Ayse Kivilcim Coskun

Three-dimensional (3D) circuits reduce communication delay in multicore SoCs, and enable efficient integration of cores, memories, sensors, and RF devices. However, vertical integration of layers exacerbates the reliability and thermal problems, and coolin ...

IEEE/IFIP Press2009

Optimal Multi-Processor SoC Thermal Simulation via Adaptive Differential Equation Solvers

Giovanni De Micheli, David Atienza Alonso, Ayse Kivilcim Coskun, Francesco Zanini

Thermal management is a critical challenge in the design of high performance multi-processor system-on-chips (MPSoCs). Therefore, accurate and fast thermal modeling tools are necessary for efficiently analyzing the thermal profiles of MPSoCs. This paper ad ...

IEEE/IFIP Press2009

Analysis and Optimization of MPSoC Reliability

Giovanni De Micheli, Yusuf Leblebici, Ayse Kivilcim Coskun

Advancements in technology enable integration of multiple devices on a single core, resulting in increased on chip power and temperature densities. Higher temperatures, in turn, present a significant challenge for reliability. In this work we propose a com ...

2006

A Simulation Methodology for Reliability Analysis in Multi-Core SoCs

Giovanni De Micheli, Yusuf Leblebici, Ayse Kivilcim Coskun

Reliability has become a significant challenge for system design in new process technologies. Higher integration levels dramatically increase power densities, which leads to higher temperature and adverse effects on reliability. In this paper, we introduce ...

ACM Press2006

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