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Fengda Sun

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Related publications (3)

Please note that this is not a complete list of this person’s publications. It includes only semantically relevant works. For a full list, please refer to Infoscience.

Self-Aligned 3D Chip Integration Technology and Through-Silicon Serial Data Transmission

The emerging three-dimensional (3D) integration technology is expected to lead to an industry paradigm shift due to its tremendous benefits. Intense research activities are going on about technology, simulation, design, and product prototypes. This thesis ...

EPFL2011

Surface-Tension-Driven Multi-Chip Self-Alignment Techniques for Heterogeneous 3D Integration

Yusuf Leblebici, Fengda Sun

Surface-tension-driven self-alignment (SA) is a promising technique for heterogeneous die-level stacking. Multiple dies can be manipulated in parallel at minimal cost. A defined amount of water present between the die and a carrier substrate is used to ali ...

IEEE Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa2011

Design and Feasibility of Multi-Gb/s Quasi-Serial Vertical Interconnects based on TSVs for 3D ICs

Yusuf Leblebici, Alessandro Cevrero, Panagiotis Athanasopoulos, Fengda Sun

This paper proposes a novel technique to exploit the high bandwidth offered by through silicon vias (TSVs). In the proposed approach, synchronous parallel 3D links are replaced by serialized links to save silicon area and increase yield. Detailed analysis ...

Ieee Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa2010