Person

Branimir Radisavljevic

This person is no longer with EPFL

Related publications (6)

Single-layer MoS₂

This thesis explores the electronic properties of one layered transition-metal dichalcogenide – single-layer MoS2, and demonstrates the first transistors and integrated circuits with characteristics that outperform graphene electronics in many aspects and ...

EPFL2013

Mobility engineering and a metal–insulator transition in monolayer MoS2

Andras Kis, Branimir Radisavljevic

Two-dimensional (2D) materials are a new class of materials with interesting physical properties and applications ranging from nanoelectronics to sensing and photonics. In addition to graphene, the most studied 2D material, monolayers of other layered mate ...

Nature Publishing Group2013

Small-signal amplifier based on single-layer MoS2

Andras Kis, Branimir Radisavljevic

In this letter we demonstrate the operation of an analog small-signal amplifier based on single-layer MoS2, a semiconducting analogue of graphene. Our device consists of two transistors integrated on the same piece of single-layer MoS2. The high intrinsic ...

American Institute of Physics2012

Semiconductor device

Andras Kis, Branimir Radisavljevic

Semiconductor device comprising a source electrode, a drain electrode and a semiconducting layer consisting of a single or double 2-dimensional layer(s) made from one of the following materials: MoS2, MoSe2, WS2, WSe2, MoTe2 or WTe2. ...

2012

Visibility of dichalcogenide nanolayers

Andras Kis, Helmuth Berger, Branimir Radisavljevic, Mohamed Malik Benameur

Dichalcogenides with the common formula MX2 are layered materials with electrical properties that range from semiconducting to superconducting. Here, we describe optimal imaging conditions for the optical detection of ultrathin, two-dimensional dichalcogen ...

Institute of Physics2011

Integrated Circuits and Logic Operations Based on Single-Layer MoS2

Andras Kis, Branimir Radisavljevic

Logic circuits and the ability to amplify electrical signals form the functional backbone of electronics along with the possibility to integrate multiple elements on the same chip. The miniaturization of electronic circuits is expected to reach fundamental ...

2011

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