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Please note that this is not a complete list of this person’s publications. It includes only semantically relevant works. For a full list, please refer to Infoscience.
Integrated circuit packaging technology has become a prime design consideration for the develop-ment of electronic system concepts. One key issue is the bonding layer between chip and substrate. Currently, high-lead solder materials are being used, which a ...
This report is the summary of what has been done for my TP4 project in second semester at "laboratory of quantum magnetism (LQM)" under the supervision Prof.H.Ronnow. This project is the continuation of first semester regarding to measurement of specific h ...