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Sub-micron scale lithography methods using deep UV, X-ray or electron beams will allow for further progress in integrated circuit hardware manufacturing. The drawback of these high-end patterning methods however is firstly, the high cost of the equipment, ...
A rapid and simple method to fabricate tiny shadow-masks and their use in multi-layer surface patterning with in situ micromechanical alignment is presented. Instead of using silicon micromachining with through-wafer etching to define the thin membrane wit ...
A new method was presented to investigate the interactions between membrane receptors and their ligands in an artificial, reconstituted membrane system. Lipid bilayers were anchored via covalently attached thiolipids to TiO2/SiO2 waveguide surfaces to prod ...
Piezoelectric micromachined ultrasonic transducers for airborne and immersed applications working in the frequency range from 20 kHz in liquid to 750 kHz in air have been fabricated and characterized, as well as simulated by finite element modelling. The b ...
A process to fabricate functional polysilicon structures above large (4 x 4 mm(2)) thin (200 nm), very flat LPCVD silicon rich nitride membranes was developed. Key features of this fabrication process are the use of low-stress LPCVD silicon nitride, sacrif ...
This paper describes a method of thin film and MEMS processing which uses self-assembled monolayers as ultra-thin organic surface coating to enable a simple removal of microfabricated devices off the surface without wet chemical etching. A 1.5-nm thick sel ...
The fabrication using silicon micromachining and characterization of an acoustic Lamb wave actuator is presented. The intended use of the device is for mass transport and sensor applications. The device consists of dual interdigitated transducers patterned ...
