Complex Oxide Nanostructures by Pulsed Laser Deposition through Nanostencils
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Silicon and silicon nitride surfaces have been successfully terminated with carboxylic acid monolayers and investigated by atomic force microscopy (AFM) and scanning near-field optical microscopy (SNOM). On clean Si surface, AFM showed topographical variat ...
Electron Beam Induced Deposition (EBID) allows deposition of three-dimensional micro- and nano-structures of conductive and insulating materials on a wide range of substrates. The process is based on the decomposition of molecules of a pre-selected precurs ...
Fabrication of high-density ferroelectric memories requires the growth of the ferroelectric material on the drain contact metal. In standard 0.5 mum technology, tungsten plugs are applied to connect the drain contacts to the first metallization level. In t ...
Gradual clogging of the apertures of nanostencils used as miniature shadow masks in metal evaporations can be reduced by coating the stencil with self-assembled monolayers (SAM). This is quantified by the dimensions (height and volume) of gold features obt ...
The atomic force microscopy in ultrahigh vacuum and at low temperature demonstrated its excellent capability to reach atomic resolution. Nevertheless in the case of biological samples high resolution has been achieved only in very few cases. We demonstrate ...
In nanocatalysis, clusters deposited on solid, well-defined surfaces play an important role. For the detection of size effects it is, however, important to prepare samples consisting of deposited clusters of a single size, as their chemical properties chan ...
Microcrystalline hydrogenated silicon films (muc-Si:H) have been deposited by a high current DC plasma in argon-silane-hydrogen mixtures at growth rates up to 10 nm/s and at substrate temperatures below 500 degreesC. Scanning electron microscopy, X-ray dif ...
AIN is a material used in a wide variety of applications such as electroacoustic devices, blue diodes, IR windows, thermal conductors, metal-insulator-semiconductor structures, integrated circuit packaging, etc. In this work thin piezoelectric AIN polycrys ...