Towards Reliable 100-Nanometer Scale Stencil Lithography on Full Wafer: Progress AND Challenges
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Sub-micron scale lithography methods using deep UV, X-ray or electron beams will allow for further progress in integrated circuit hardware manufacturing. The drawback of these high-end patterning methods however is firstly, the high cost of the equipment, ...
The continuous improvements in conventional lithography methods for integrated circuit hardware allow further device shrinkage deep into the sub-micron dimensions. Two major drawbacks of these high-end patterning methods based on photoresist technologies a ...
Increased flexibility in patterning becomes important for the engineering of advanced nano/micro-electro-mechanical systems (NEMS/MEMS). Surfaces to be structured are either mechanically unstable and/or (bio-) chemically functionalized, such as ultra-thin ...
