Semiconductor packageA semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure.
Indium gallium arsenideIndium gallium arsenide (InGaAs) (alternatively gallium indium arsenide, GaInAs) is a ternary alloy (chemical compound) of indium arsenide (InAs) and gallium arsenide (GaAs). Indium and gallium are group III elements of the periodic table while arsenic is a group V element. Alloys made of these chemical groups are referred to as "III-V" compounds. InGaAs has properties intermediate between those of GaAs and InAs. InGaAs is a room-temperature semiconductor with applications in electronics and photonics.
Conchoidal fractureConchoidal fracture describes the way that brittle materials break or fracture when they do not follow any natural planes of separation. Mindat.org defines conchoidal fracture as follows: "a fracture with smooth, curved surfaces, typically slightly concave, showing concentric undulations resembling the lines of growth of a shell". Materials that break in this way include quartz, chert, flint, quartzite, jasper, and other fine-grained or amorphous materials with a composition of pure silica, such as obsidian and window glass, as well as a few metals, such as solid gallium.
