High aspect ratio UV photolithography for electroplated structures
Graph Chatbot
Chat with Graph Search
Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.
DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.
This thesis deals with the development of microfabrication technologies based on photoplastic structuring by lithographic and molding techniques. These technologies, combined with an original releasing method, allow for the simple fabrication of pseudo thr ...
Sub-micron scale lithography methods using deep UV, X-ray or electron beams will allow for further progress in integrated circuit hardware manufacturing. The drawback of these high-end patterning methods however is firstly, the high cost of the equipment, ...
A tool and method for flexible and rapid surface patterning technique beyond lithography based on high-resolution shadow mask method, or nanostencil, is presented. This new type of miniaturized shadow mask is fabricated by a combination of MEMS processes a ...
Ferroelectric thin films for memory and MEMS applications require noble metal or refractory metal oxide electrodes. In this paper, physical and chemical parameters during etching of RuO2 and Pr by a dual frequency ECR/RF reactor have been investigated. The ...
We describe an approach to optical lithography using light-scattering contact masks with protruding elements that couple light into a photoresist. This method differs from conventional contact lithography in two important ways. First, because portions of t ...
Ferroelectric thin films for memory and MEMS applications require noble metal or refractory metal oxide electrodes. In this paper, physical and chemical mechanisms during platinum etching by a dual frequency ECR/RF reactor have been investigated. An ion be ...
This study presents two techniques of structuration of type UV-LIGA (Lithographie, Galvanisierung und Abformung) based on the use of two thick photoresists which are a dry film resist called Riston® from DuPont and the new SU-8 negative-working resist from ...
