Correlation of microstructural and mechanical properties in particle reinforced lead-free solders
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Estimation of the stress distribution in the solder or glue joint between a cantilever and its base, and of the corresponding bending stress distribution in the cantilever. This reports details results of modelling of the stresses in the solder or glue joi ...
Diffusion Brazing (DB) of nickel-based superalloys is a standard joining process widely used in gas turbine industry. The DB technique uses a low melting nickel-based filler material, which contains a rapidly diffusing melting point depressant (MPD) such a ...
To gain insight into the physical nature of the coupling between mechanical stress and humidity variations, the behaviour of thin wood strips was studied using specially developed apparatus for creep/recovery and relaxation/blotting-out tests in a controll ...
A microstructural analysis and tensile tests were performed on two oxide dispersion strengthened ferritic/martensitic steels. Dispersion hardening represents an interesting approach to improve the mechanical properties at elevated temperatures, as they are ...
A series of polyquasicrystalline ingots with the nominal composition Al63.6Cu24.0Fe12.4 has been prepared by conventional drop casting and subsequent annealing at 1088 K for 24 h. Compression specimens prepared from the different ingots have been deformed ...
The possibility of decreasing ultimate tensile strength associated with increasing fiber/matrix interfacial sliding is investigated in ceramic-matrix composites. An axisymmetric finite-element model is used to calculate axial fiber stresses versus radial p ...
The deformation of copper with grain size less than 10 nm is investigated using a 2D continuum model incorporating atomistically-based constitutive relations. The local constitutive response of a series of symmetric and asymmetric tilt grain boundaries is ...
In cold pilgering of tubes, a material element undergoes a series of small incremental deformations (≈100 strokes), alternatively under tensile and compressive stresses. This complex history sometimes results in surface damage, seemingly by low-cycle fatig ...
In this paper, the stability of a displacement sensor assembled with Sn96 (tin- silver) solder, Sn62 (tin-leadsilver) solder or conductive silver-loaded epoxy glue was compared. In the absence of humidity or thermal cycling, the glue was found to be much b ...
During cure of epoxy resins, polymerization induces an increase in mechanical properties, which is accompanied by a volumetric shrinkage. When the resin is cured in a constrained mold to which it adheres, tensile stresses will hence develop, which may exce ...