Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
Graph Chatbot
Chat with Graph Search
Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.
DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.
With increasing power densities, runtime thermal management is becoming a necessity in today’s systems, especially so for highly integrated Multi-Processor Systems-on-Chip (MPSoCs). In this paper, we propose a neural network (NN) based approach to implemen ...
The role of Field-Programmable Gate Arrays (FPGAs) in System-on-Chip (SoC) design considerably increased in the last few years. Their established importance is due to the large amount of hardware resources they offer, as well as to their increasing perform ...
This article presents a study on the dynamics of lateral motion of a liquid meniscus confined by a pad and a chip moving parallel to the pad. This problem is a typical flip-chip case study, whose use is widespread in industrial assembly. The proposed model ...
As 3D chip multi-processors (3D-CMPs) become the main trend in processor development, various thermal management strategies have been recently proposed to optimize system performance while controlling the temperature of the system to stay below a threshold ...
New tendencies envisage 2D and 3D Multi-Processor Systems-On-Chip (MPSoCs) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute multiple applications (games, video), while meeting additional design ...
In deep submicron circuits, high temperatures have created critical issues in reliability, timing, performance, coolings costs and leakage power. Task migration techniques have been proposed to manage efficiently the thermal distribution in multi-processor ...
Technology scaling imposes an ever increasing temperature stress on digital circuit design due to transistor density, especially on highly integrated systems, such as Multi- Processor Systems-on-Chip (MPSoCs). Therefore, temperature-aware design is mandato ...
The selective use of carry-save arithmetic, where appropriate, can accelerate a variety of arithmetic-dominated circuits. Carry-save arithmetic occurs naturally in a variety of DSP applications, and further opportunities to exploit it can be exposed throug ...
The development of compiler-based mechanisms to reduce the percentage of hotspots and optimize the thermal profile of large register files has become an important issue. Thermal hotspots have been known to cause severe reliability issues, while the thermal ...
Network-on-Chip (NoC) has emerged as a very promising paradigm for designing scalable communication architecture for Systems-on-Chips (SoCs). However, NoCs designed to fulfill the bandwidth requirements between the cores of an SoC for a certain set of runn ...
