Smart Power IC simulation of substrate coupled current due to majority and minority carriers transports
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In this paper, we describe a systematic low-power design methodology for technologies that offer a strong body factor. Specifically, we explore both the body bias voltage and the supply voltage knobs in order to find the MEP (minimum energy point) for a co ...
The Internet of Things market is experiencing a period of intense growth. From 7 to 10 billion of connected devices in 2013, it is expected to reach 26 to 30 billion in 2020. Smart buildings represent between 2 to 21% of this market. Indeed, the possibilit ...
A 3-D simulation of substrate currents is crucial to analyze parasitic coupling effects due to minority carrier injection in smart power ICs. In this paper, a substrate parasitic extraction methodology is introduced by dividing the IC layout into elementar ...
Today automotive industry is demanding more and more compact solutions for embedded electronics to be interfaced with vehicles components such as motor drivers, igniters and car communication buses. That is why Smart Power Integrated Circuits (IC) have bee ...
The load tracking performance of combined cooling, heating, and power multi-energy system (CCHP-MES) greatly depends on the equipment capacity configuration. And the frequent fluctuations in the source-load uncertainty puts higher demands on the load track ...