Publication

Er-doped Al2O3 thin films deposited by high-vacuum chemical vapor deposition (HV-CVD)

Abstract

Erbium-doped amorphous aluminum oxide layers deposited on Si or oxidized silicon substrates are promising construction pieces for future monolytic integrated optoelectronics devices. In a novel high-vacuum chemical vapor deposition setup the alumina films are grown with high homogeneity on 4 in. wafers with well controlled growth rate, chemical composition, and high deposition rates of up to 20 nm/min. The HV-CVD applies thermal decomposition of aluminum-isopropoxide with or without additional oxygen as reactive partner gas. Arbitrarily chosen values for different parameters show that deposition works in a wide parameter range and that the chemical composition, the roughness, growth rate, and the resulting index of refraction and optical guiding properties need a systematic study of the working window of the process. Nevertheless optical guiding at 670 nm wavelength-is demonstrated and addition of erbium tetramethyl-heptanedionate as erbium precursor results in co-deposition of erbium in the alumina layers. (C) 2007 Elsevier B.V. All rights reserved.

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Related concepts (32)
Chemical vapor deposition
Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.
Evaporation (deposition)
Evaporation is a common method of thin-film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel directly to the target object (substrate), where they condense back to a solid state. Evaporation is used in microfabrication, and to make macro-scale products such as metallized plastic film. Evaporation involves two basic processes: a hot source material evaporates and condenses on the substrate. It resembles the familiar process by which liquid water appears on the lid of a boiling pot.
Pulsed laser deposition
Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.
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