Plasma-enhanced chemical vapor depositionPlasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases. The plasma is generally created by radio frequency (RF) (alternating current (AC)) frequency or direct current (DC) discharge between two electrodes, the space between which is filled with the reacting gases.
Copper proteinCopper proteins are proteins that contain one or more copper ions as prosthetic groups. Copper proteins are found in all forms of air-breathing life. These proteins are usually associated with electron-transfer with or without the involvement of oxygen (O2). Some organisms even use copper proteins to carry oxygen instead of iron proteins. A prominent copper proteins in humans is in cytochrome c oxidase (cco). The enzyme cco mediates the controlled combustion that produces ATP.
Copper in architectureCopper has earned a respected place in the related fields of architecture, building construction, and interior design. From cathedrals to castles and from homes to offices, copper is used for a variety of architectural elements, including roofs, flashings, gutters, downspouts, domes, spires, vaults, wall cladding, and building expansion joints. The history of copper in architecture can be linked to its durability, corrosion resistance, prestigious appearance, and ability to form complex shapes.
Copper in biologyCopper is an essential trace element that is vital to the health of all living things (plants, animals and microorganisms). In humans, copper is essential to the proper functioning of organs and metabolic processes. The human body has complex homeostatic mechanisms which attempt to ensure a constant supply of available copper, while eliminating excess copper whenever this occurs. However, like all essential elements and nutrients, too much or too little nutritional ingestion of copper can result in a corresponding condition of copper excess or deficiency in the body, each of which has its own unique set of adverse health effects.
Copper sulfideCopper sulfides describe a family of chemical compounds and minerals with the formula CuxSy. Both minerals and synthetic materials comprise these compounds. Some copper sulfides are economically important ores. Prominent copper sulfide minerals include Cu2S (chalcocite) and CuS (covellite). In the mining industry, the minerals bornite or chalcopyrite, which consist of mixed copper-iron sulfides, are often referred to as "copper sulfides". In chemistry, a "binary copper sulfide" is any binary chemical compound of the elements copper and sulfur.
Copper(I) oxideCopper(I) oxide or cuprous oxide is the inorganic compound with the formula Cu2O. It is one of the principal oxides of copper, the other being or copper(II) oxide or cupric oxide (CuO). Cuprous oxide is a red-coloured solid and is a component of some antifouling paints. The compound can appear either yellow or red, depending on the size of the particles. Copper(I) oxide is found as the reddish mineral cuprite. Copper(I) oxide may be produced by several methods.H.
Ore genesisVarious theories of ore genesis explain how the various types of mineral deposits form within Earth's crust. Ore-genesis theories vary depending on the mineral or commodity examined. Ore-genesis theories generally involve three components: source, transport or conduit, and trap. (This also applies to the petroleum industry: petroleum geologists originated this analysis.) Source is required because metal must come from somewhere, and be liberated by some process.
Atomic layer depositionAtomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical process; it is a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals called precursors (also called "reactants"). These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. A thin film is slowly deposited through repeated exposure to separate precursors.
