Convex-Based Thermal Management for 3D MPSoCs Using DVFS and Variable-Flow Liquid Cooling
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3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertical integration of layers exacerbates the reliability and thermal problems, a ...
The development of compiler-based mechanisms to reduce the percentage of hotspots and optimize the thermal profile of large register files has become an important issue. Thermal hotspots have been known to cause severe reliability issues, while the thermal ...
The purpose of this literature review is to compare different cooling technologies currently in development in research laboratories that are competing to solve the challenge of cooling the next generation of high heat flux computer chips. Today, most deve ...
Nowadays, efficiency improvement of the modern gas turbines is usually achieved by increasing the pressure ratio which leads to an increase of the gas temperature in the combustion chamber. As a consequence, the temperature conditions imposed on the first ...
Heat generation is a very conspicuous phenomenon in large scale bioreactors and could in principle quite easily be measured by the temp. increase of the cooling water. Taking yeast cultures growing on a mixed oxido-reductive metab. for various reasons as a ...