Low voltage vertical flaps arrays as optical modulating elements for reflective display and switchable gratings
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In this paper we propose a new method for rendering crowds of virtual humans with dynamicallydeformed skeletons with levels of detail using two simple caching schemes for animations and geometry. Weshow how the virtual heritage project ERATO pushed for the ...
We carried out an ab initio investigation of the charged states of hydrogen in amorphous SiO2 using a previously generated model structure. We found a large variety of equilibrium configurations as a result of the disordered atomic structure in our model s ...
In this work novel concepts for the realization of miniature integrated optical sensor systems are presented. An important aspect for all realized approaches was their suitability for the use of disposable sensor chips. This is essential, especially for ap ...
The use of chemoselective ligation methods and orthogonal protection techniques allows access to Template-Assembled Synthetic Protein (TASP) mols. exhibiting a large variety of packing topologies. This is demonstrated for the synthesis of an antiparallel 4 ...
This work addresses feature size effects (the lag-effect and roughness development) in chemically assisted ion beam etching (CAIBE) etching of InP-based photonic crystals. Photonic crystal fields with varying hole size and periods were etched with differen ...
International Society for Optical Engineering, Bellingham WA, WA 98227-0010, United States2006
This paper presents a hybrid push and pull production management approach called double speed single production line (DSSPL), developed for industries that produce a large variety of slightly different items subject to highly variable demand. Because of th ...
A large variety of plasma conditions has been created in TCV (Tokamak a Configuration Variable, B-T < 1.5 T, R-0 = 0.88 m, a < 0.25 m). They include limited and diverted discharges with elongations in the range 1-2.58, triangularities between -0.7 and 1 as ...
A large variety of physical analysis techniques are used in the semiconductor industry to identify defects impacting yield or reliability. Identification of a defect often requires the combined use of several techniques to give a clear understanding of th ...