Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
CantileverA cantilever is a rigid structural element that extends horizontally and is supported at only one end. Typically it extends from a flat vertical surface such as a wall, to which it must be firmly attached. Like other structural elements, a cantilever can be formed as a beam, plate, truss, or slab. When subjected to a structural load at its far, unsupported end, the cantilever carries the load to the support where it applies a shear stress and a bending moment. Cantilever construction allows overhanging structures without additional support.
Spring (device)A spring is a device consisting of an elastic but largely rigid material (typically metal) bent or molded into a form (especially a coil) that can return into shape after being compressed or extended. Springs can store energy when compressed. In everyday use the term often refers to coil springs, but there are many different spring designs. Modern springs are typically manufactured from spring steel. An example of a non-metallic spring is the bow, made traditionally of flexible yew wood, which when drawn stores energy to propel an arrow.
Semiconductor fabrication plantIn the microelectronics industry, a semiconductor fabrication plant (commonly called a fab; sometimes foundry) is a factory for semiconductor device fabrication. Fabs require many expensive devices to function. Estimates put the cost of building a new fab over one billion U.S. dollars with values as high as 3–4billionnotbeinguncommon.TSMCinvested9.3 billion in its Fab15 300 mm wafer manufacturing facility in Taiwan. The same company estimations suggest that their future fab might cost $20 billion. Leaf springA leaf spring is a simple form of spring commonly used for suspension in wheeled vehicles. Originally called a laminated or carriage spring, and sometimes referred to as a semi-elliptical spring, elliptical spring, or cart spring, it is one of the oldest forms of vehicle suspension. A leaf spring is one or more narrow, arc-shaped, thin plates that are attached to the axle and chassis in a way that allows the leaf spring to flex vertically in response to irregularities in the road surface.
Hooke's lawIn physics, Hooke's law is an empirical law which states that the force (F) needed to extend or compress a spring by some distance (x) scales linearly with respect to that distance—that is, F_s = kx, where k is a constant factor characteristic of the spring (i.e., its stiffness), and x is small compared to the total possible deformation of the spring. The law is named after 17th-century British physicist Robert Hooke. He first stated the law in 1676 as a Latin anagram.
Atomic force microscopyAtomic force microscopy (AFM) or scanning force microscopy (SFM) is a very-high-resolution type of scanning probe microscopy (SPM), with demonstrated resolution on the order of fractions of a nanometer, more than 1000 times better than the optical diffraction limit. Atomic force microscopy (AFM) is a type of scanning probe microscopy (SPM), with demonstrated resolution on the order of fractions of a nanometer, more than 1000 times better than the optical diffraction limit.
Second moment of areaThe second moment of area, or second area moment, or quadratic moment of area and also known as the area moment of inertia, is a geometrical property of an area which reflects how its points are distributed with regard to an arbitrary axis. The second moment of area is typically denoted with either an (for an axis that lies in the plane of the area) or with a (for an axis perpendicular to the plane). In both cases, it is calculated with a multiple integral over the object in question.
Process designIn chemical engineering, process design is the choice and sequencing of units for desired physical and/or chemical transformation of materials. Process design is central to chemical engineering, and it can be considered to be the summit of that field, bringing together all of the field's components. Process design can be the design of new facilities or it can be the modification or expansion of existing facilities. The design starts at a conceptual level and ultimately ends in the form of fabrication and construction plans.
Bending momentIn solid mechanics, a bending moment is the reaction induced in a structural element when an external force or moment is applied to the element, causing the element to bend. The most common or simplest structural element subjected to bending moments is the beam. The diagram shows a beam which is simply supported (free to rotate and therefore lacking bending moments) at both ends; the ends can only react to the shear loads. Other beams can have both ends fixed (known as encastre beam); therefore each end support has both bending moments and shear reaction loads.
