PrintingPrinting is a process for mass reproducing text and images using a master form or template. The earliest non-paper products involving printing include cylinder seals and objects such as the Cyrus Cylinder and the Cylinders of Nabonidus. The earliest known form of printing as applied to paper was woodblock printing, which appeared in China before 220 AD for cloth printing. However, it would not be applied to paper until the seventh century.
Fused filament fabricationFused filament fabrication (FFF), also known as fused deposition modeling (with the trademarked acronym FDM), or filament freeform fabrication, is a 3D printing process that uses a continuous filament of a thermoplastic material. Filament is fed from a large spool through a moving, heated printer extruder head, and is deposited on the growing work. The print head is moved under computer control to define the printed shape.
Data link layerThe data link layer, or layer 2, is the second layer of the seven-layer OSI model of computer networking. This layer is the protocol layer that transfers data between nodes on a network segment across the physical layer. The data link layer provides the functional and procedural means to transfer data between network entities and may also provide the means to detect and possibly correct errors that can occur in the physical layer. The data link layer is concerned with local delivery of frames between nodes on the same level of the network.
Dew pointThe dew point of a given body of air is the temperature to which it must be cooled to become saturated with water vapor. This temperature depends on the pressure and water content of the air. When the air is cooled below the dew point, its moisture capacity is reduced and airborne water vapor will condense to form liquid water known as dew. When this occurs through the air's contact with a colder surface, dew will form on that surface. The dew point is affected by the air's humidity.
Transport layerIn computer networking, the transport layer is a conceptual division of methods in the layered architecture of protocols in the network stack in the Internet protocol suite and the OSI model. The protocols of this layer provide end-to-end communication services for applications. It provides services such as connection-oriented communication, reliability, flow control, and multiplexing. The details of implementation and semantics of the transport layer of the Internet protocol suite, which is the foundation of the Internet, and the OSI model of general networking are different.
Step responseThe step response of a system in a given initial state consists of the time evolution of its outputs when its control inputs are Heaviside step functions. In electronic engineering and control theory, step response is the time behaviour of the outputs of a general system when its inputs change from zero to one in a very short time. The concept can be extended to the abstract mathematical notion of a dynamical system using an evolution parameter.
Printed circuit boardA printed circuit board (PCB), also called printed wiring board (PWB), is a medium used to connect or "wire" components to one another in a circuit. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.
Time constantIn physics and engineering, the time constant, usually denoted by the Greek letter τ (tau), is the parameter characterizing the response to a step input of a first-order, linear time-invariant (LTI) system. The time constant is the main characteristic unit of a first-order LTI system. In the time domain, the usual choice to explore the time response is through the step response to a step input, or the impulse response to a Dirac delta function input.
Fabless manufacturingFabless manufacturing is the design and sale of hardware devices and semiconductor chips while outsourcing their fabrication (or fab) to a specialized manufacturer called a semiconductor foundry. These foundries are typically, but not exclusively, located in the United States, China, and Taiwan. Fabless companies can benefit from lower capital costs while concentrating their research and development resources on the end market. Some fabless companies and pure play foundries (like TSMC) may offer integrated-circuit design services to third parties.
Integrated circuit packagingIn electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
