César Pulgarin, Juan Kiwi, Sami Rtimi, Oualid Baghriche
Recently, compact uniform and adhesive films of Ag and Cu have been prepared by DC-magnetron sputtering (DC), pulsed DC magnetron sputtering (DCP) and high power impulse magnetron sputtering (HIPIMS). This study reports the HIPIMS deposition for Ag and Cu ...
Elsevier Science Sa2014