Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation
Related publications (42)
Graph Chatbot
Chat with Graph Search
Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.
DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.
The present study focuses on an experimental investigation of two-phase flow boiling in a silicon multi-microchannel evaporator, which emulates a single layer of a 3D stacked computer chip. The micro-evaporator is comprised of 67 parallel channels, each ha ...
Improving the energy efficiency of cooling systems can contribute to reduce the emission of greenhouse gases. Currently, most microelectronic applications are air-cooled. Switching to two-phase cooling systems would decrease power consumption and allow for ...
The first cool-down of the EDIPO (European DIPOle) test facility is foreseen to take place in 2011 by means of the existing 1.2 kW cryoplant at EPFL-CRPP Villigen. In this work, the thermo-hydraulic analysis of the EDIPO cool-down is performed in order bot ...
Three-dimensional (3D) stacking is an attractive method for designing large manycore chips as it provides high transistor integration densities, improves manufacturing yield due to smaller chip area, reduces wirelength and capacitance, and enables heteroge ...
Institute of Electrical and Electronics Engineers2011
Hot-spots are present in micro-electronics and are challenging to cool effectively. This paper presents highly nonuniform heat flux measurements obtained for a pseudo-CPU with 35 local heaters and temperature sensors cooled by a silicon multi-microchannel ...
Continuous development of highly efficient and compact cooling elements are driven by extensive developments of Micro-Electro-Mechanical Systems (MEMS) devices such as microprocessors or micro high-powered laser systems. As microprocessors continue to head ...
A theoretical and numerical model to predict film condensation heat transfer in mini, micro and ultra micro-channels of different internal shapes is presented in this thesis. The model is based on a finite volume formulation of the Navier-Stokes and energy ...
The flow pattern based flow boiling heat transfer and two-phase pressure drop models for CO2, recently developed by Cheng et al. [L Cheng, G. Ribatski. J. Moreno Quiben, J.R. Thome, New prediction methods for CO2 evaporation inside tubes: Part I - A two-ph ...
Interlayer cooling is the only heat removal concept which scales with the number of active tiers in a vertically integrated chip stack. In this work, we numerically and experimentally characterize the performance of a three tier chip stack with a footprint ...
A constructaltree-shaped microchannel network for maximizing the saturated critical heat flux in a disc-shaped planar body has been investigated. n(0) radial channels touch the center and n(p) channels touch the periphery. Designs with no pairing level (n( ...