Design and Benchmarking of Hybrid CMOS-Spin Wave Device Circuits Compared to 10nm CMOS
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This paper presents a fully integrated power management and sensing microsystem that harvests solar energy from a micro-power photovoltaic module for autonomous operation of a miniaturized hydrogen sensor. In order to measure H-2 concentration, conductance ...
The electronics industry is present nowadays in the most various applications. A new type of technology for integrated circuits named BCD has started to be developed and appeared from the mid 1980’s. This new technology allows integrating bipolar transisto ...
Logic circuits and the ability to amplify electrical signals form the functional backbone of electronics along with the possibility to integrate multiple elements on the same chip. The miniaturization of electronic circuits is expected to reach fundamental ...
Microfluidics plays a key role in the design of automated platforms for realizing biological assays in a miniaturized format. Several advantages are offered by a microfluidic system, namely, low sample and reagent consumption (typically a few microliters), ...
Wireless communications are showing an explosive growth in emerging consumer and military applications of radiofrequency (RF), microwave, and millimeter-wave circuits and systems. Applications include wireless personal connectivity (Bluetooth), wireless lo ...
The state-of-the-art scaled down CMOS processes have led to devices with extremely high Ft reaching several hundreds of GHz. This high F t can be traded with power consumption by moving the operating point towards weak inversion with Ft reaching tens of GH ...
Power density and energy dissipation of digital IC's has become one of the main concerns during the recent years. With the increased usage of battery powered devices, ubiquitous computing, and increase in implantable biomedical applications, enhancing ener ...
A simple time-to-digital converter (TDC), capable of detecting not only phase difference but also frequency difference, is presented. The proposed TDC guarantees pull-in even for PLLs with the lowest loop gain. The TDC is fabricated in a 65 nm CMOS process ...
Wafer-scale nanostencil lithography (nSL) is used to define several types of silicon mechanical resonators, whose dimensions range from 20 μm down to 200 nm, monolithically integrated with CMOS circuits. We demonstrate the simultaneous patterning by nSL of ...
Single-photon avalanche diodes (SPADs) are evaluated in two sub-100nm CMOS technologies. Several geometries are implemented, whereas premature edge breakdown (PEB) prevention is achieved with n-well rings. The octagonal SPADs are implemented in 90nm and 65 ...