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PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays

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PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays

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Integrated Microfluidic Power Generation and Cooling for Bright Silicon MPSoCs

Dynamic Modeling and Experimental Evaluation of a Controlled Two-Phase On-Chip Cooling System Designed for High Efficiency Datacenters

Thermal Simulation of Liquid-Cooled Integrated Circuits

STEAM: a fast compact thermal model for two-phase cooling of integrated circuits

Numerical study of the heating-cooling effects on the geotechnical behaviour of energy piles.

A Combined Sensor Placement and Convex Optimization Approach for Thermal Management in 3D-MPSoC with Liquid Cooling

Towards Multi-Fabric 3D Integration Architectures

3D Integration Technology for Lab-on-a-Chip Applications

Performance and Profitability Perspectives of a CO2 based District Energy Network in Geneva’s City Center

A Fully Integrated 0.18-um CMOS Transceiver Chip for X-Band Phased-Array Systems