Plasma etchingPlasma etching is a form of plasma processing used to fabricate integrated circuits. It involves a high-speed stream of glow discharge (plasma) of an appropriate gas mixture being shot (in pulses) at a sample. The plasma source, known as etch species, can be either charged (ions) or neutral (atoms and radicals). During the process, the plasma generates volatile etch products at room temperature from the chemical reactions between the elements of the material etched and the reactive species generated by the plasma.
Plume (fluid dynamics)In hydrodynamics, a plume or a column is a vertical body of one fluid moving through another. Several effects control the motion of the fluid, including momentum (inertia), diffusion and buoyancy (density differences). Pure jets and pure plumes define flows that are driven entirely by momentum and buoyancy effects, respectively. Flows between these two limits are usually described as forced plumes or buoyant jets. "Buoyancy is defined as being positive" when, in the absence of other forces or initial motion, the entering fluid would tend to rise.
IgnitronAn ignitron is a type of gas-filled tube used as a controlled rectifier and dating from the 1930s. Invented by Joseph Slepian while employed by Westinghouse, Westinghouse was the original manufacturer and owned trademark rights to the name "Ignitron". Ignitrons are closely related to mercury-arc valves but differ in the way the arc is ignited. They function similarly to thyratrons; a triggering pulse to the igniter electrode turns the device "on", allowing a high current to flow between the cathode and anode electrodes.
Poppet valveA poppet valve (also sometimes called mushroom valve) is a valve typically used to control the timing and quantity of gas or vapor flow into or out of an engine, but with many other applications. It consists of a hole or open-ended chamber, usually round or oval in cross-section, and a plug, usually a disk shape on the end of a shaft known as a valve stem. The working end of this plug, the valve face, is typically ground at a 45° bevel to seal against a corresponding valve seat ground into the rim of the chamber being sealed.
