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PDC microfabrication through KOH-etched Si mould casting

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PDC microfabrication through KOH-etched Si mould casting

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Combined Al-protection and HF-vapour release process for ultrathin cantilevers

Pattern recovery by dry etching of gap-induced blurring in nanostencil lithography

Deep-ultraviolet-microelectromechanicaI systems stencils for high-throughput resistless. patterning of mesoscopic structures

Deep-ultraviolet–microelectromechanical systems stencils for high-throughput resistless patterning of mesoscopic structures

Nanomechanical structures with 91 MHz resonance frequency fabricated by local deposition and dry etching

Fabrication and characterization of metal nanolevers made by shadow mask technology

Fabrication and application of a full wafer size micro/nanostencil for multiple length-scale surface patterning

90 MHz nanomechanical structures fabricated by stencil deposition and dry etching

90 MHz nanomechanical structures fabricated by stencil deposition and dry etching

DEEP ANISOTROPIC ETCHING OF SILICON USING LOW PRESSURE HIGH DENSITY PLASMA. PRESENTATION OF COMPLEMENTARY TECHNIQUES AND THEIR APPLICATIONS IN MICROTECHNOLOGY.

Combined Al-protection and HF-vapour release process for ultrathin cantilevers

Pattern recovery by dry etching of gap-induced blurring in nanostencil lithography

Deep-ultraviolet-microelectromechanicaI systems stencils for high-throughput resistless. patterning of mesoscopic structures

Deep-ultraviolet–microelectromechanical systems stencils for high-throughput resistless patterning of mesoscopic structures

90 MHz nanomechanical structures fabricated by stencil deposition and dry etching

Nanomechanical structures with 91 MHz resonance frequency fabricated by local deposition and dry etching

Fabrication and characterization of metal nanolevers made by shadow mask technology

Fabrication and application of a full wafer size micro/nanostencil for multiple length-scale surface patterning

90 MHz nanomechanical structures fabricated by stencil deposition and dry etching

DEEP ANISOTROPIC ETCHING OF SILICON USING LOW PRESSURE HIGH DENSITY PLASMA. PRESENTATION OF COMPLEMENTARY TECHNIQUES AND THEIR APPLICATIONS IN MICROTECHNOLOGY.