Gamma rayA gamma ray, also known as gamma radiation (symbol γ or ), is a penetrating form of electromagnetic radiation arising from the radioactive decay of atomic nuclei. It consists of the shortest wavelength electromagnetic waves, typically shorter than those of X-rays. With frequencies above 30 exahertz (3e19Hz), it imparts the highest photon energy. Paul Villard, a French chemist and physicist, discovered gamma radiation in 1900 while studying radiation emitted by radium.
Positron emission tomographyPositron emission tomography (PET) is a functional imaging technique that uses radioactive substances known as radiotracers to visualize and measure changes in metabolic processes, and in other physiological activities including blood flow, regional chemical composition, and absorption. Different tracers are used for various imaging purposes, depending on the target process within the body. For example, -FDG is commonly used to detect cancer, NaF is widely used for detecting bone formation, and oxygen-15 is sometimes used to measure blood flow.
Neutron detectionNeutron detection is the effective detection of neutrons entering a well-positioned detector. There are two key aspects to effective neutron detection: hardware and software. Detection hardware refers to the kind of neutron detector used (the most common today is the scintillation detector) and to the electronics used in the detection setup. Further, the hardware setup also defines key experimental parameters, such as source-detector distance, solid angle and detector shielding.
Bismuth germanateBismuth germanium oxide or bismuth germanate is an inorganic chemical compound of bismuth, germanium and oxygen. Most commonly the term refers to the compound with chemical formula (BGO), with the cubic evlitine crystal structure, used as a scintillator. (The term may also refer to a different compound with formula Bi12GeO20, an electro-optical material with sillenite structure, and .) Bi4Ge3O12 has a cubic crystal structure (a = 1.0513 nm, z = 4, Pearson symbol cI76, space group I3d No. 220) and a density of 7.
CMOSComplementary metal–oxide–semiconductor (CMOS, pronounced "sea-moss", siːmɑːs, -ɒs) is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips (including CMOS BIOS), and other digital logic circuits.
Vacuum tubeA vacuum tube, electron tube, valve (British usage), or tube (North America), is a device that controls electric current flow in a high vacuum between electrodes to which an electric potential difference has been applied. The type known as a thermionic tube or thermionic valve utilizes thermionic emission of electrons from a hot cathode for fundamental electronic functions such as signal amplification and current rectification.
AnnihilationIn particle physics, annihilation is the process that occurs when a subatomic particle collides with its respective antiparticle to produce other particles, such as an electron colliding with a positron to produce two photons. The total energy and momentum of the initial pair are conserved in the process and distributed among a set of other particles in the final state. Antiparticles have exactly opposite additive quantum numbers from particles, so the sums of all quantum numbers of such an original pair are zero.
Smoke detectorA smoke detector is a device that senses smoke, typically as an indicator of fire. Smoke detectors are usually housed in plastic enclosures, typically shaped like a disk about in diameter and thick, but shape and size vary. Smoke can be detected either optically (photoelectric) or by physical process (ionization). Detectors may use one or both sensing methods. Sensitive alarms can be used to detect and deter smoking in banned areas. Smoke detectors in large commercial and industrial buildings are usually connected to a central fire alarm system.
Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
Die shrinkThe term die shrink (sometimes optical shrink or process shrink) refers to the scaling of metal–oxide–semiconductor (MOS) devices. The act of shrinking a die creates a somewhat identical circuit using a more advanced fabrication process, usually involving an advance of lithographic nodes. This reduces overall costs for a chip company, as the absence of major architectural changes to the processor lowers research and development costs while at the same time allowing more processor dies to be manufactured on the same piece of silicon wafer, resulting in less cost per product sold.
