Thermal design powerThe thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called scenario design power (SDP) for some Ivy Bridge Y-series processors.
Fault (geology)In geology, a fault is a planar fracture or discontinuity in a volume of rock across which there has been significant displacement as a result of rock-mass movements. Large faults within Earth's crust result from the action of plate tectonic forces, with the largest forming the boundaries between the plates, such as the megathrust faults of subduction zones or transform faults. Energy release associated with rapid movement on active faults is the cause of most earthquakes. Faults may also displace slowly, by aseismic creep.
Power managementPower management is a feature of some electrical appliances, especially copiers, computers, computer CPUs, computer GPUs and computer peripherals such as monitors and printers, that turns off the power or switches the system to a low-power state when inactive. In computing this is known as PC power management and is built around a standard called ACPI, this supersedes APM. All recent computers have ACPI support.
Finite element methodThe finite element method (FEM) is a popular method for numerically solving differential equations arising in engineering and mathematical modeling. Typical problem areas of interest include the traditional fields of structural analysis, heat transfer, fluid flow, mass transport, and electromagnetic potential. The FEM is a general numerical method for solving partial differential equations in two or three space variables (i.e., some boundary value problems).
Applied physicsApplied physics is the application of physics to solve scientific or engineering problems. It is usually considered a bridge or a connection between physics and engineering. "Applied" is distinguished from "pure" by a subtle combination of factors, such as the motivation and attitude of researchers and the nature of the relationship to the technology or science that may be affected by the work.
San Andreas FaultThe San Andreas Fault is a continental right-lateral strike-slip transform fault that extends roughly through the Californias. It forms the tectonic boundary between the Pacific Plate and the North American Plate. Traditionally, for scientific purposes, the fault has been classified into three main segments (northern, central, and southern), each with different characteristics and a different degree of earthquake risk. The average slip rate along the entire fault ranges from per year.
Transform faultA transform boundary occurs when two tectonic plates move past one another. Shear stress operates at transform boundaries, which involves sliding motion. No lithosphere is destroyed or created, and mountain chains are not built at transform boundaries. They accommodate the lateral offset between segments of divergent boundaries, forming a zigzag pattern. This is a result of oblique seafloor spreading where the direction of motion is not perpendicular to the trend of the overall divergent boundary.
