Indium phosphideIndium phosphide (InP) is a binary semiconductor composed of indium and phosphorus. It has a face-centered cubic ("zincblende") crystal structure, identical to that of GaAs and most of the III-V semiconductors. Indium phosphide can be prepared from the reaction of white phosphorus and indium iodide at 400 °C., also by direct combination of the purified elements at high temperature and pressure, or by thermal decomposition of a mixture of a trialkyl indium compound and phosphine.
System in a packageA system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using package on package, placed side by side, and/or embedded in the substrate. The SiP performs all or most of the functions of an electronic system, and is typically used when designing components for mobile phones, digital music players, etc.
POWER9POWER9 is a family of superscalar, multithreading, multi-core microprocessors produced by IBM, based on the Power ISA. It was announced in August 2016. The POWER9-based processors are being manufactured using a 14 nm FinFET process, in 12- and 24-core versions, for scale out and scale up applications, and possibly other variations, since the POWER9 architecture is open for licensing and modification by the OpenPOWER Foundation members.
RockchipRockchip (Fuzhou Rockchip Electronics Co., Ltd.) is a Chinese fabless semiconductor company based in Fuzhou, Fujian province. Rockchip has been providing SoC products for tablets & PCs, streaming media TV boxes, AI audio & vision, IoT hardware since founded in 2001. It has offices in Shanghai, Beijing, Shenzhen, Hangzhou and Hong Kong. It designs system on a chip (SoC) products, using the ARM architecture licensed from ARM Holdings for the majority of its projects. Rockchip was one of the top 50 fabless C suppliers in 2018.
